Silicon photonic packaging and integration for Tbps optical interconnects

Hiren D. Thacker

doi:10.1117/12.3003460

12 March 2024 Silicon photonic packaging and integration for Tbps optical interconnects

Hiren D. Thacker

Proceedings Volume PC12892, Optical Interconnects XXIV; PC128920F (2024) https://doi.org/10.1117/12.3003460
Event: SPIE OPTO, 2024, San Francisco, California, United States

Abstract

Silicon Photonics has emerged as the leading technology platform for high-speed, high density, and low power optical interconnects addressing hyperscale datacenter, high-performance computing, mobile and enterprise applications. Advanced 3D integration using through silicon vías (TSVs) for low parasitic interconnection and power delivery, along with high throughput, submicron waveguide to optical fiber attachment and laser integration will be essential to enable higher data rate per lane interconnects in Tbps optical transceivers on the horizon. In this paper, we will review trends in photonics packaging architecture for scale up and scale out of optical interconnects, critical technology challenges and path to technology adoption for high volume productization.

Conference Presentation

Citation Download Citation

Hiren D. Thacker "Silicon photonic packaging and integration for Tbps optical interconnects", Proc. SPIE PC12892, Optical Interconnects XXIV, PC128920F (12 March 2024); https://doi.org/10.1117/12.3003460

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