Extrinsic Silicon Focal-Plane Technology

Dieter H. Pommerrenig

doi:10.1117/12.958704

6 August 1980 Extrinsic Silicon Focal-Plane Technology

Dieter H. Pommerrenig

Proceedings Volume 0225, Infrared Image Sensor Technology; (1980) https://doi.org/10.1117/12.958704
Event: 1980 Technical Symposium East, 1980, Washington, D.C., United States

Abstract

Both monolithic and hybrid silicon focal planes are presently considered for future IR system applications. Significant progress has been made in the development of two-dimensional arrays because the IR detection properties of extrinsic silicon are well developed and the state of the art of manufacturing CCD devices is within the commercial industrial domain. Monolithic focal planes (MFP) combine the function of signal radiation conversion and electronic signal readout and processing in one device, whereas in a hybrid focal plane (HFP), the detection function is physically separated from the charge injection and transfer function; both devices are mechanically interconnected via a metallic bump matrix. The monolithic approaches benefit from the utilization of only one device. The hybrid approaches, on the other hand, benefit from the, ability to optimize and select independently the sensing and processing elements.

Citation Download Citation

Dieter H. Pommerrenig "Extrinsic Silicon Focal-Plane Technology", Proc. SPIE 0225, Infrared Image Sensor Technology, (6 August 1980); https://doi.org/10.1117/12.958704

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