Laminated Mosaic Module Performance Measurements

Gary L. Payton; Larry G. Pfaffly; William R. Reitman

doi:10.1117/12.959500

17 December 1980 Laminated Mosaic Module Performance Measurements

Gary L. Payton, Larry G. Pfaffly, William R. Reitman

Proceedings Volume 0253, Modern Utilization of Infrared Technology VI; (1980) https://doi.org/10.1117/12.959500
Event: 24th Annual Technical Symposium, 1980, San Diego, United States

Abstract

Laminated mosaic modules, a z-technology are introduced as an alternative architectural configuration for mosaic sensor focal plane applications. The module features a 4096 element (8x512) PbS array with 64 thirty-two input signal processing chips. Modules can be stacked into subarrays without a composite array fill factor loss. Measurements and results confirm the performance status of this technology development approach. Module components are discussed first followed by the module assembly and the subarray (a four module stack).

Citation Download Citation

Gary L. Payton, Larry G. Pfaffly, and William R. Reitman "Laminated Mosaic Module Performance Measurements", Proc. SPIE 0253, Modern Utilization of Infrared Technology VI, (17 December 1980); https://doi.org/10.1117/12.959500

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