Paper
4 May 2017 Multispectral very wide-view sensing concept
Author Affiliations +
Abstract
Major features and system-level design considerations for 3-D array apertures with hemispherical coverage are presented. First, an ideal 3-D dome-like hemispherical aperture is simulated using physical optics. Second, 3-D smooth aperture shape is approximated by several planar facets each presenting identical 2-D aperture arrays. Optimal division of hemispherical field of view into sectors of regards with similar maximum angular scan extent is discussed along with optimization of major electrical features of planar array facets, their number and total component count.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
A. O. Boryssenko "Multispectral very wide-view sensing concept", Proc. SPIE 10185, Cyber Sensing 2017, 101850B (4 May 2017); https://doi.org/10.1117/12.2267702
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Cited by 1 scholarly publication.
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KEYWORDS
Antennas

Polarization

3D modeling

Signal attenuation

Electromagnetism

Optical simulations

Sensors

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