An introduction of resistive arrays and packaging technology

Quan Sun; Dafu Liu; Haimei Gong

doi:10.1117/12.2285546

24 October 2017 An introduction of resistive arrays and packaging technology

Quan Sun, Dafu Liu, Haimei Gong

Proceedings Volume 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications; 104624G (2017) https://doi.org/10.1117/12.2285546
Event: Applied Optics and Photonics China (AOPC2017), 2017, Beijing, China

Abstract

As an important way to simulate the dynamic infrared scene, the technology of resistive arrays, especially large format resistive arrays are developing very fast. Principle of resistive arrays is introduced. The unit cell is composed by two MOS transistors, a capacitor and a resistor. The resistor is the main element to make infrared radiation by heating. Key parameters, such as temperature, frame rate, uniformity and cross-talk are used to standard to evaluate the performance of the arrays. Several methods to improve the parameters is put forward. In addition, development and current situation of the packaging technology is discussed and analyzed in this paper. At last, the technology developments of resistive arrays and packaging are summed up and an outlook of the future is provided.

Citation Download Citation

Quan Sun, Dafu Liu, and Haimei Gong "An introduction of resistive arrays and packaging technology", Proc. SPIE 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications, 104624G (24 October 2017); https://doi.org/10.1117/12.2285546

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