Image-based overlay and alignment metrology through optically opaque media with sub-surface probe microscopy

Maarten H. van Es; Abbas Mohtashami; Daniele Piras; Hamed Sadeghian

doi:10.1117/12.2299956

13 March 2018 Image-based overlay and alignment metrology through optically opaque media with sub-surface probe microscopy

Maarten H. van Es, Abbas Mohtashami, Daniele Piras, Hamed Sadeghian

Author Affiliations +

Proceedings Volume 10585, Metrology, Inspection, and Process Control for Microlithography XXXII; 105850R (2018) https://doi.org/10.1117/12.2299956
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

Nondestructive subsurface nanoimaging through optically opaque media is considered to be extremely challenging and is essential for several semiconductor metrology applications including overlay and alignment and buried void and defect characterization. The current key challenge in overlay and alignment is the measurement of targets that are covered by optically opaque layers. Moreover, with the device dimensions moving to the smaller nodes and the issue of the so-called loading effect causing offsets between between targets and product features, it is increasingly desirable to perform alignment and overlay on product features or so-called on-cell overlay, which requires higher lateral resolution than optical methods can provide. Our recently developed technique known as SubSurface Ultrasonic Resonance Force Microscopy (SSURFM) has shown the capability for high-resolution imaging of structures below a surface based on (visco-)elasticity of the constituent materials and as such is a promising technique to perform overlay and alignment with high resolution in upcoming production nodes. In this paper, we describe the developed SSURFM technique and the experimental results on imaging buried features through various layers and the ability to detect objects with resolution below 10 nm. In summary, the experimental results show that the SSURFM is a potential solution for on-cell overlay and alignment as well as detecting buried defects or voids and generally metrology through optically opaque layers.

Conference Presentation

Citation Download Citation

Maarten H. van Es, Abbas Mohtashami, Daniele Piras, and Hamed Sadeghian "Image-based overlay and alignment metrology through optically opaque media with sub-surface probe microscopy", Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105850R (13 March 2018); https://doi.org/10.1117/12.2299956

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available