Research on the mechanism of atmospheric pressure plasma processing after grinding the fused silica glass

Bin Wang; Shengguan Qu

doi:10.1117/12.2500065

24 July 2018 Research on the mechanism of atmospheric pressure plasma processing after grinding the fused silica glass

Bin Wang, Shengguan Qu

Proceedings Volume 10827, Sixth International Conference on Optical and Photonic Engineering (icOPEN 2018); 1082704 (2018) https://doi.org/10.1117/12.2500065
Event: Sixth International Conference on Optical and Photonic Engineering (icOPEN 2018), 2018, Shanghai, China

Abstract

Atmospheric pressure plasma technology has been presented as an effective tool in relieving or removing subsurface damage induced by previous mechanical machining process. However, the surface morphology evolution and mechanism during removing the subsurface damage using atmospheric pressure plasma processing after grinding to remove the subdamage is rarely reported. In this research, this procedure is studied based on experiments and measurement. Even if some unique properties of atmospheric pressure plasma processing are observed, such as particle exposure. From the mechanical machining to atmospheric plasma blasting, the R_PV value increase from 1.338 μm to 1.361 μm due to some singular deep cracks that are not fully healed or filled by the abrasives. Corresponding peak-tovalley and RMS roughness evolution is investigated as well. It is revealed that the atmospheric pressure plasma process may end up with a planar surface depending on the damage removing. Density of the damage has more significant effect on the roughness evolution than damage depth.

Citation Download Citation

Bin Wang and Shengguan Qu "Research on the mechanism of atmospheric pressure plasma processing after grinding the fused silica glass", Proc. SPIE 10827, Sixth International Conference on Optical and Photonic Engineering (icOPEN 2018), 1082704 (24 July 2018); https://doi.org/10.1117/12.2500065

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