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4 March 2019 Pure copper layer formation on copper based alloy substrate with 100 W class blue diode laser
T. Hata, M. Tsukamoto, Y. Sato, R. Higasino, Y. Funada, N. Abe
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Proceedings Volume 10909, Laser 3D Manufacturing VI; 109090Y (2019) https://doi.org/10.1117/12.2507818
Event: SPIE LASE, 2019, San Francisco, California, United States
Abstract
In order to clarify the influence of light absorption characteristics and thermal conductivity of the substrate in forming a pure copper layer using multi-laser cladding system, a pure copper layer was formed on two type substrates. Two lasers were combined at a focal point to set a spot diameter of 507 μm. At the same time, pure copper powder having an average particle size of 34 μm was supplied from a center nozzle. The powder melted and solidified to form a pure copper layer on the substrate surface. The copper coated samples were cut with a micro-cutter, and cross section was observed with the microscope to investigate layer thickness, penetration depth and material organization. As a result, it was confirmed that the copper layer became larger as the laser input energy increased. And compared with the substrates of stainless steel and copper alloy, it was found that the input energy of copper alloy substrate required about 3 times more energy than that of stainless steel substrate. Therefore, it was revealed that the laser input energy depended on the thermal conductivity of the substrate.
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T. Hata, M. Tsukamoto, Y. Sato, R. Higasino, Y. Funada, and N. Abe "Pure copper layer formation on copper based alloy substrate with 100 W class blue diode laser", Proc. SPIE 10909, Laser 3D Manufacturing VI, 109090Y (4 March 2019); https://doi.org/10.1117/12.2507818
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KEYWORDS
Copper
Semiconductor lasers
Cladding
Absorption
Laser energy
Particles
Laser processing
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