Presentation
22 February 2021 3D integration and process effects in superconducting qubit devices
Author Affiliations +
Abstract
Quantum computers perform calculations using quantum bits, or qubits, which can be made from superconducting circuits. These superconducting qubits allow direct control over device parameters while leveraging conventional Si-based fabrication techniques. MIT Lincoln Laboratory is designing and building high performance superconducting qubit devices with increased connectivity and addressability by utilizing advanced process techniques and 3D integration. Our three-tier stack architecture combines separately fabricated qubit, interposer, and routing chips with indium bump bonding. This stack contains high performance qubits, resonators, and couplers, superconducting air bridge crossovers, hard-stop spacing control, superconducting high aspect-ratio through-Si vias, and planarized superconducting routing layers. I will discuss our most recent accomplishments in the fabrication of three-tier stack devices and the effects of additional processing on the uniformity and integrity of their individual components.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bethany M. Niedzielski "3D integration and process effects in superconducting qubit devices", Proc. SPIE 11615, Advanced Etch Technology and Process Integration for Nanopatterning X, 116150F (22 February 2021); https://doi.org/10.1117/12.2583734
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KEYWORDS
Quantum communications

Superconductors

Bridges

Computing systems

Control systems

Fabrication

Indium

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