Analysis of advanced technology nodes and h-NA EUV introduction: a cost perspective

Gioele Mirabelli; Jane Wang; Darko Trivkovic; Pieter Weckx; Alessio Spessot; Kurt Ronse; Ryoung Han Kim; Geert Hellings; Julien Ryckaert

doi:10.1117/12.2600804

12 October 2021 Analysis of advanced technology nodes and h-NA EUV introduction: a cost perspective

Gioele Mirabelli, Jane Wang, Darko Trivkovic, Pieter Weckx, Alessio Spessot, Kurt Ronse, Ryoung Han Kim, Geert Hellings, Julien Ryckaert

Author Affiliations +

Proceedings Volume 11854, International Conference on Extreme Ultraviolet Lithography 2021; 118540D (2021) https://doi.org/10.1117/12.2600804
Event: SPIE Photomask Technology + EUV Lithography, 2021, Online Only

Abstract

The continued need to satisfy the Power-Performance-Area requirements in advanced technologies resulted in a steady and rapid increase in manufacturing costs in the last years. Indeed, novel process integration schemes can require advanced tools and/or new materials, further aggravating cost. In addition, several dimensions are slowing down reaching a plateau due to physical limitations, which can impact the resulting die cost. Therefore, in this work we analyze advanced technology nodes from a cost perspective, considering different patterning and integration schemes at 3 nm and 2 nm node as this is becoming more and more important. Also, possible scenarios regarding the introduction of high-NA EUV lithography at the 2 nm node are explored, showing promising results from both a cost and a yield perspective.

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Gioele Mirabelli, Jane Wang, Darko Trivkovic, Pieter Weckx, Alessio Spessot, Kurt Ronse, Ryoung Han Kim, Geert Hellings, and Julien Ryckaert "Analysis of advanced technology nodes and h-NA EUV introduction: a cost perspective", Proc. SPIE 11854, International Conference on Extreme Ultraviolet Lithography 2021, 118540D (12 October 2021); https://doi.org/10.1117/12.2600804

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