Application of the Raman Microprobe Mole to the Characterization of Microelectronic Materials and the Analysis of Manufacturing Defects

Fran Adar

doi:10.1117/12.963920

5 February 1990 Application of the Raman Microprobe Mole to the Characterization of Microelectronic Materials and the Analysis of Manufacturing Defects

Fran Adar

Author Affiliations +

Proceedings Volume 1186, Surface and Interface Analysis of Microelectronic Materials Processing and Growth; (1990) https://doi.org/10.1117/12.963920
Event: 1989 Microelectronic Integrated Processing Conferences, 1989, Santa Clara, United States

Abstract

The Raman Microprobe MOLE provides the capability to acquire analytical quality Raman spectra with him spatial resolution. These spectra allow molecular and/or crystalline identification for contaminant analysis and microstructural studies. The ability of the Raman microprobe to identify organic contaminants is unique in the arsenal of analytical tools available in the manufacture of integrated circuits. Structural studies of materials undergoing engineering development include semiconductor superlattices, superconductors, diamond and diamond-like carbon (DLC) films.

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Fran Adar "Application of the Raman Microprobe Mole to the Characterization of Microelectronic Materials and the Analysis of Manufacturing Defects", Proc. SPIE 1186, Surface and Interface Analysis of Microelectronic Materials Processing and Growth, (5 February 1990); https://doi.org/10.1117/12.963920

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