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13 June 2022 Technology for the smart and connected world – era of data explosion
Jongwook Kye
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Proceedings Volume 12052, DTCO and Computational Patterning; 1205206 (2022) https://doi.org/10.1117/12.2623364
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States
Abstract
Emerging AI and 5G applications such as connected devices, autonomous vehicles, virtual/augmented reality, and clouds are driving beyond traditional pitch scaling. Wired and wireless infrastructure devices are accelerating their migration towards leading-edge technologies in order to achieve higher performance, better power efficiency, and improved functionality, which leads unprecedented demand for compute power in datacenters and communication infrastructures. In addition, high-speed interfaces are supporting faster data throughput and improved connectivity. But the area scaling and performance improvement of semiconductors are getting harder every year and numerous technologies are suggested to overcome these limitations. In this presentation we aim to provide an overview of the requirements, outline some of the key design parameters and provide a few examples of contemporary soluions beyond traditional Moore’s-Law scaling for the insatiable compute demand.
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Jongwook Kye "Technology for the smart and connected world – era of data explosion", Proc. SPIE 12052, DTCO and Computational Patterning, 1205206 (13 June 2022); https://doi.org/10.1117/12.2623364
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KEYWORDS
Artificial intelligence
Clouds
Lead
Semiconductors
Unmanned vehicles
Wireless communications
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