Measurement method of high temperature full-field thermal deformation of materials based on digital image correlation

Huanqing Wang; Pengxiang Ge; Qian Zhang; Shuangle Wu; Yilei Zhu; Yonghong Wang

doi:10.1117/12.2611987

19 November 2021 Measurement method of high temperature full-field thermal deformation of materials based on digital image correlation

Huanqing Wang, Pengxiang Ge, Qian Zhang, Shuangle Wu, Yilei Zhu, Yonghong Wang

Author Affiliations +

Proceedings Volume 12059, Tenth International Symposium on Precision Mechanical Measurements; 120590U (2021) https://doi.org/10.1117/12.2611987
Event: Tenth International Symposium on Precision Mechanical Measurements, 2021, Qingdao, China

Abstract

In order to measure the full-field thermal deformation of materials in high temperature environment, a full-field thermal deformation measurement method based on high temperature digital image correlation is proposed in this paper.In this method, monochromatic polarized light is used as the lighting source, and the polarizing camera combined with narrowband filter is used as the image acquisition system to collect images under high temperature environment. Through optical imaging and optical filtering system, visible radiation can be initially filtered to minimize the thermal radiation on the specimen surface. And the image gray average method is also used in this paper to eliminate the thermal disturbance error and vibration error in the measurement process to improve the measurement accuracy.Finally, a set of high temperature digital image correlation measurement system was built, and the thermal deformation test was carried out on the ceramic materials. The experimental results show that the system can realize the clear image with high-contrast acquisition under high temperature conditions, and can effectively eliminate the interference of vibration and thermal disturbance noise in the measurement under high temperature .

Citation Download Citation

Huanqing Wang, Pengxiang Ge, Qian Zhang, Shuangle Wu, Yilei Zhu, and Yonghong Wang "Measurement method of high temperature full-field thermal deformation of materials based on digital image correlation", Proc. SPIE 12059, Tenth International Symposium on Precision Mechanical Measurements, 120590U (19 November 2021); https://doi.org/10.1117/12.2611987

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