Wafer-level curved sensor manufacturing process for enhanced optical system designs

Wilfried Jahn; Michael Bailly; Gregoire Hein

doi:10.1117/12.2603631

19 November 2021 Wafer-level curved sensor manufacturing process for enhanced optical system designs

Wilfried Jahn, Michael Bailly, Gregoire Hein

Proceedings Volume 12078, International Optical Design Conference 2021; 120780M (2021) https://doi.org/10.1117/12.2603631
Event: International Optical Design Conference - IODC 2021, 2021, Online Only

Abstract

Curved sensors bring a paradigm shift in the design of optical systems, enhancing performance and unlocking new scientific and consumer applications. We present our wafer-level shaping capability enabling to reach various sensor shapes.

Conference Presentation

Citation Download Citation

Wilfried Jahn, Michael Bailly, and Gregoire Hein "Wafer-level curved sensor manufacturing process for enhanced optical system designs", Proc. SPIE 12078, International Optical Design Conference 2021, 120780M (19 November 2021); https://doi.org/10.1117/12.2603631

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