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Emerging applications such as light detection and ranging (LiDAR), on-chip interconnect and neuromorphic photonics demand higher complexity and integration density in photonic integrated circuits (PICs). Conventional InP PICs, although offers seamless integration of actives and passives, cannot meet this demand. In this talk, a InP membrane photonics platform will be presented and its recent progress will be reviewed. It features sub-micron waveguides together with native amplifiers. Therefore it has potential to achieving active-passive photonic integration with order-ofmagnitude higher density and complexity.
Yuqing Jiao
"High density photonic integration on an InP membrane", Proc. SPIE 12425, Smart Photonic and Optoelectronic Integrated Circuits 2023, 124250J (17 March 2023); https://doi.org/10.1117/12.2647467
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Yuqing Jiao, "High density photonic integration on an InP membrane," Proc. SPIE 12425, Smart Photonic and Optoelectronic Integrated Circuits 2023, 124250J (17 March 2023); https://doi.org/10.1117/12.2647467