Full-size visual inspection system and method for semiconductor packaging lead-frame

Shaoqing Han; Feifei Gu

doi:10.1117/12.2675113

28 June 2023 Full-size visual inspection system and method for semiconductor packaging lead-frame

Shaoqing Han, Feifei Gu

Proceedings Volume 12720, 2022 Workshop on Electronics Communication Engineering; 127200L (2023) https://doi.org/10.1117/12.2675113
Event: 2022 Workshop on Electronics Communication Engineering (WECE 2022), 2022, Xi'an, China

Abstract

Semiconductor packaging lead-frame has the characteristics of high density, high precision, refinement, and miniaturization. However, traditional manual detection has a series of problems such as difficulty, low efficiency, and high miss rate. Aiming at this industry problem, this paper develops a full-scale detection system and corresponding detection method of semiconductor packaging lead frame based on machine vision. The developed system is composed of a motion control platform and system, hardware control systems such as light source camera, and image algorithm platform. Through the optimized visual detection algorithm and the accurate correction method of workpiece attitude under motion measurement conditions, it can realize the one-click adjustment of several key dimensions such as frame length, width, loading area thickness, pin thickness, bending height, and aperture Micron level measurement, high precision, and fast speed, effectively ensure the genuine product rate and control the scrap rate, to assist semiconductor packaging enterprises to save labor costs and improve production efficiency.

Citation Download Citation

Shaoqing Han and Feifei Gu "Full-size visual inspection system and method for semiconductor packaging lead-frame", Proc. SPIE 12720, 2022 Workshop on Electronics Communication Engineering, 127200L (28 June 2023); https://doi.org/10.1117/12.2675113

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