Presentation + Paper
21 November 2023 Functional underlayers for dose reduction and collapse mitigation in EUV lithography: a factorial analysis
Author Affiliations +
Abstract
It is renowned that underlayers can enhance photoresist performance in extreme ultraviolet lithography via chemical/physical interactions, but these effects are elusive to identify. Using factorial analysis, we pinpoint which underlayer parameters have or have not an effect on the lithography patterning quality of chemically amplified and metal oxide resists in three proposed experiments. Experimental factors were underlayer thickness, density, surface roughness, surface energy and composition; the outputs were: dose, exposure latitude, line roughness and its correlation length.
Conference Presentation
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Roberto Fallica, Weizhong Huang, Hyo Seon Suh, Danilo De Simone, Douglas J. Guerrero, and Kodai Kato "Functional underlayers for dose reduction and collapse mitigation in EUV lithography: a factorial analysis", Proc. SPIE 12750, International Conference on Extreme Ultraviolet Lithography 2023, 127500I (21 November 2023); https://doi.org/10.1117/12.2687546
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KEYWORDS
Factor analysis

Extreme ultraviolet lithography

Photoresist materials

Surface roughness

Line width roughness

Statistical analysis

Extreme ultraviolet

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