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5 October 2023 LITHOSCALE features accomplish dual exposure and high-resolution patterning
Ksenija Varga, Thomas Uhrmann, Roman Holly, Tobias Zenger, Chris Milasincic, Mel Zussman, Ron Legario, Michael Knaus
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Proceedings Volume 12802, 38th European Mask and Lithography Conference (EMLC 2023); 128020B (2023) https://doi.org/10.1117/12.2675899
Event: 38th European Mask and Lithography Conference, 2023, Dresden, Germany
Abstract
The concept of dual layer pattering as an alternative to POR in interconnect formation has been evaluated on maskless exposure technology. The novel dielectric materials negative tone PBO were used for the concept prove. The process optimization was conducted by varying the exposure and spin coating paraments. The lowest feature size accomplished was even <4 μm proving the two–step structures with FT of the first layer 50% of the dual layer FT. This new concept represents contribution to the improved CoO setup in the advanced packaging processes.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Ksenija Varga, Thomas Uhrmann, Roman Holly, Tobias Zenger, Chris Milasincic, Mel Zussman, Ron Legario, and Michael Knaus "LITHOSCALE features accomplish dual exposure and high-resolution patterning", Proc. SPIE 12802, 38th European Mask and Lithography Conference (EMLC 2023), 128020B (5 October 2023); https://doi.org/10.1117/12.2675899
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KEYWORDS
Dielectrics
Optical lithography
Advanced packaging
Film thickness
Lithography
Semiconducting wafers
Coating
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