Presentation + Paper
20 June 2024 Ultrafast laser drilling of through vias in soda-lime glass using GHz-burst mode operation
Pierre Balage, John Lopez, Manon Lafargue, Théo Guilberteau, Guillaume Bonamis, Clemens Hönninger, Inka B. Manek-Hönninger
Author Affiliations +
Abstract
In this contribution we show through via drillings in dielectrics by ultrafast laser top-down percussion drilling in GHzburst mode. We point out some limitations that occur during the drilling process and show how to overcome these. Finally, we obtained through vias of almost constant diameter in Sodalime glass, which might be of interest in the microelectronics industry for the fabrication of glass interposers.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Pierre Balage, John Lopez, Manon Lafargue, Théo Guilberteau, Guillaume Bonamis, Clemens Hönninger, and Inka B. Manek-Hönninger "Ultrafast laser drilling of through vias in soda-lime glass using GHz-burst mode operation", Proc. SPIE 13005, Laser + Photonics for Advanced Manufacturing, 1300504 (20 June 2024); https://doi.org/10.1117/12.3017014
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KEYWORDS
Glasses

Laser drilling

Ultrafast lasers

Femtosecond phenomena

Femtosecond pulse shaping

Laser processing

Microelectronics

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