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18 June 2024 Scalable PIC packaging and polarization control in CPO
Florian Merget, Manuel Ackermann, Bin Shen, Rebecca Rodrigo, Huiyi Wang, Michael Wolz, Jeremy Witzens
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Proceedings Volume 13012, Integrated Photonics Platforms III; 130120C (2024) https://doi.org/10.1117/12.3026055
Event: SPIE Photonics Europe, 2024, Strasbourg, France
Abstract
The emergence of co-packaged optics and of parallel optics pluggable form factors with an increased number of fibers poses new challenges for optical packaging technologies. We describe micro-optical interposers manufactured with isothermal glass molding that enable the parallelized connection of large fiber arrays with photonic integrated circuits in a low-rise form factor as well as the management of scrambled light polarization from a remote laser source coupled by single mode fiber. A resonantly assisted but temperature tolerant silicon photonics Mach-Zehnder modulator operated in lumped element configuration is co-developed for that purpose and a concept for a 6.4 Tb/s bi-directional light engine described.
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(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Florian Merget, Manuel Ackermann, Bin Shen, Rebecca Rodrigo, Huiyi Wang, Michael Wolz, and Jeremy Witzens "Scalable PIC packaging and polarization control in CPO", Proc. SPIE 13012, Integrated Photonics Platforms III, 130120C (18 June 2024); https://doi.org/10.1117/12.3026055
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KEYWORDS
Polarization
Photonic integrated circuits
Glasses
Electrooptic modulators
Glass molding
Packaging
Electrooptics
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