Analyzing thermal conductance measurements in microbolometers

A.J. Syllaios; Gavin Farmer; Alia Naciri; Usha Philipose; Chris Littler

doi:10.1117/12.3028134

3 October 2024 Analyzing thermal conductance measurements in microbolometers

A.J. Syllaios, Gavin Farmer, Alia Naciri, Usha Philipose, Chris Littler

Author Affiliations +

Proceedings Volume 13145, Infrared Sensors, Devices, and Applications XIV; 1314503 (2024) https://doi.org/10.1117/12.3028134
Event: Optical Engineering + Applications, 2024, San Diego, California, United States

Abstract

Thermal conductance is a controlling parameter for heat transfer in microbolometer based infrared imaging systems. The thermal conductance can be measured by monitoring the microbolometer temperature change induced by a known electrical power excitation due to constant voltage or current Joule heating at thermal equilibrium. The temperature change is calculated from the corresponding resistance change by using the conduction mechanism for the microbolometer thermosensitive material. For amorphous semiconductor materials, such as VOx and amorphous silicon, electrical conduction is by Variable Range Hopping (VRH), specifically, Efros-Shklovskii VRH for VOx, and Mott VRH for amorphous silicon. Calculation results are compared to published thermal conductance measurements based on linear approximations of the electrical conductivity temperature dependence.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

A.J. Syllaios, Gavin Farmer, Alia Naciri, Usha Philipose, and Chris Littler "Analyzing thermal conductance measurements in microbolometers", Proc. SPIE 13145, Infrared Sensors, Devices, and Applications XIV, 1314503 (3 October 2024); https://doi.org/10.1117/12.3028134

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