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Hitherto, however, such thermomechanical-stress-aware design has been focused on the detector-readout assemblies. The effect of the IRFPA packaging on the overall IRFPA performance under thermal load remains underexplored. Typically, the packaging involves a Balanced Composite Structure (BCS) sandwiched between the detector chip and the base plate for improving the thermomechanical reliability. In this work, we discuss the impact material choices in BCS has on the induced thermal stresses in critical components of the detector-readout assembly. We show that for an existing intricate and non-linear interplay between the detector chip, Si ROIC, and the BCS components, it may be beneficial to tune the thickness of the Si ROIC and to consider multi-parameter geometry and material optimization for designing IRFPA and packaging assemblies with optimal thermal performance. Further, we also suggest the novel material properties within the BCS stack that yield optimal thermomechanical response in the detector chip for chosen device configurations. |
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Readout integrated circuits
Silicon
Packaging
Metals
Mercury cadmium telluride
Indium
Dielectrics
