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In the quest to secure the authenticity and ownership of advanced integrated circuit (IC) packages, a novel approach has been introduced in this paper that capitalizes on the inherent physical discrepancies within these components. This method, distinct from traditional strategies like physical unclonable functions (PUFs) and cryptographic techniques, harnesses the unique defect patterns naturally occurring during the manufacturing process. By employing thermo-reflectance imaging (TRI), a non-destructive evaluation technique, in this proposed method we inspect, characterize and localize defects within IC package structures such as Through-silicon Vias (TSV) and micro-bumps. TRI’s ability to detect minute temperature variations caused by defects enables the creation of a detailed map that outlines the specific locations and types of manufacturing irregularities. This novel technique leverages the uniqueness of each IC’s defect pattern to generate an inherent identifier or ’fault-mark.’ These identifiers are derived from the specific arrangement and combination of defects, making them virtually impossible to replicate or forge due to the randomness and complexity of the manufacturing process variations. The creation of these fault-marks offers a robust and tamper-resistant means of authentication, providing a reliable method for establishing proof of ownership for advanced IC packages. The implementation of this approach not only can enhance supply chain security but also acts as a deterrent against the counterfeiting of IC packages. By verifying the authenticity of ICs against a reference database of fingerprints captured during the post-silicon validation stage, stakeholders can ensure the integrity of their components. This method’s potential of using inherent fingerprinting for reliable authentication and traceability of advanced IC packages is also been discussed, thereby offering a promising solution to the challenges of counterfeiting and unauthorized reproduction in the electronics industry.
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