Packaging technology for GaAs MMIC (monolithic microwave integrated circuits) modules

Hisashi Tomimuro

doi:10.1117/12.25578

1 April 1991 Packaging technology for GaAs MMIC (monolithic microwave integrated circuits) modules

Hisashi Tomimuro

Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25578
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

Gallium arsenide monolithic microwave integrated circuits(GaAs MMICs) have been developed to operate at 1 to 30GHz. Their packaging technologies are classified into several levels ranging from a microwave package design to an interconnection technology. This paper reviews the status of and trends in the packaging tech nologies for GaAs MMIC modules.

Citation Download Citation

Hisashi Tomimuro "Packaging technology for GaAs MMIC (monolithic microwave integrated circuits) modules", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); https://doi.org/10.1117/12.25578

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