Paper
16 April 1993 Application-specific resist stripping with integrated processing in a single multiple-process chamber
Richard L. Bersin
Author Affiliations +
Proceedings Volume 1803, Advanced Techniques for Integrated Circuit Processing II; (1993) https://doi.org/10.1117/12.142930
Event: Microelectronic Processing '92, 1992, San Jose, CA, United States
Abstract
A multi-process chamber has been developed for ashing of photoresist. Using microwave downstream and RIE processing, ashing processes have been developed which result in residues soluble in DI water, bypassing the need for solvent or acid treatment.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard L. Bersin "Application-specific resist stripping with integrated processing in a single multiple-process chamber", Proc. SPIE 1803, Advanced Techniques for Integrated Circuit Processing II, (16 April 1993); https://doi.org/10.1117/12.142930
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Cited by 2 scholarly publications.
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KEYWORDS
Etching

Microwave radiation

Photoresist materials

Chemistry

Reactive ion etching

Semiconducting wafers

Aluminum

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