Paper
12 July 1993 Conformal acoustic waveguide sensor development
Jeffrey N. Schoess, J. David Zook
Author Affiliations +
Abstract
This paper describes the detailed design of an acoustic emission-based micromachined sensor for smart structures applications to assess in-flight structural integrity. This unique sensor approach combines silicon sensor micromachining, conformal optical waveguide technology, and high-speed optical interconnects to measure acoustic emission event data related to structural failure. A micron-level dual-element micromachined cantilever beam architecture design is described which incorporates conformal on-chip polyimide optical waveguide interconnects to optically sense structural integrity acoustic parameters and route optical power to the sensor assembly. High-speed optical interconnects are used to transfer sensor data to avionic interfaces for debrief and detailed analysis. A detailed design of the optical waveguide sensor design and the significant payoffs and benefits of these sensors are discussed.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jeffrey N. Schoess and J. David Zook "Conformal acoustic waveguide sensor development", Proc. SPIE 1918, Smart Structures and Materials 1993: Smart Sensing, Processing, and Instrumentation, (12 July 1993); https://doi.org/10.1117/12.148010
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Sensors

Waveguide sensors

Waveguides

Acoustics

Smart structures

Silicon

Aerospace engineering

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