Paper
15 September 1993 Influence of residual casting solvent on the dissolution behavior of diazonaphthoquinone resists
Veena Rao, William D. Hinsberg, Curtis W. Frank, Roger Fabian W. Pease
Author Affiliations +
Abstract
Residual casting solvent present in resist films can have a profound effect on their dissolution behavior. We have used a radiolabeling technique to make quantitative measurements of solvent remaining in spin cast films after they have undergone different baking protocols. Films of poly (3-methyl-4-hydroxystyrene) were found to contain a significant fraction of propylene glycol methyl ether acetate (as much as 50% by weight) depending on the baking conditions. Films that were 1000 angstroms thick contained a higher percentage of residual solvent than films that were 1 micrometers . The solvent concentration in films containing a mixture of polymer and photoactive compound was a maximum for films containing 5 wt% PAC.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Veena Rao, William D. Hinsberg, Curtis W. Frank, and Roger Fabian W. Pease "Influence of residual casting solvent on the dissolution behavior of diazonaphthoquinone resists", Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); https://doi.org/10.1117/12.154789
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Cited by 2 scholarly publications.
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KEYWORDS
Polymers

Polymer thin films

Picture Archiving and Communication System

Glasses

Hydrogen

Coating

Ellipsometry

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