Microchannel-cooled heatsinks for high-average-power laser diode arrays

William J. Benett; Barry L. Freitas; Dino R. Ciarlo; Raymond J. Beach; Steven B. Sutton; Mark A. Emanuel; Richard W. Solarz

doi:10.1117/12.163832

12 November 1993 Microchannel-cooled heatsinks for high-average-power laser diode arrays

William J. Benett, Barry L. Freitas, Dino R. Ciarlo, Raymond J. Beach, Steven B. Sutton, Mark A. Emanuel, Richard W. Solarz

Author Affiliations +

Proceedings Volume 1997, High Heat Flux Engineering II; (1993) https://doi.org/10.1117/12.163832
Event: SPIE's 1993 International Symposium on Optics, Imaging, and Instrumentation, 1993, San Diego, CA, United States

Abstract

Detailed performance results for an efficient and low thermal impedance laser diode array heatsink are presented. High duty factor and even cw operation of fully filled laser diode arrays at high stacking densities are enabled at high average power. Low thermal impedance is achieved using a liquid coolant and laminar flow through microchannels. The microchannels are fabricated in silicon using an anisotropic chemical etching process. A modular rack-and- stack architecture is adopted for heatsink design, allowing arbitrarily large 2-D arrays to be fabricated and easily maintained. The excellent thermal control of the microchannel heatsinks is ideally suited to pump array requirements for high average power crystalline lasers because of the stringent temperature demands that are required to efficiently couple diode light to several-nanometer-wide absorption features characteristic of lasing ions in crystals.

Citation Download Citation

William J. Benett, Barry L. Freitas, Dino R. Ciarlo, Raymond J. Beach, Steven B. Sutton, Mark A. Emanuel, and Richard W. Solarz "Microchannel-cooled heatsinks for high-average-power laser diode arrays", Proc. SPIE 1997, High Heat Flux Engineering II, (12 November 1993); https://doi.org/10.1117/12.163832

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