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27 September 1993 Dynamic response of mode III interface crack in bonded materials
Ya-Pu Zhao, Jing Fang
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Proceedings Volume 1999, Adhesives Engineering; (1993) https://doi.org/10.1117/12.158605
Event: SPIE's 1993 International Symposium on Optics, Imaging, and Instrumentation, 1993, San Diego, CA, United States
Abstract
This paper concerns the problems of dynamic response of the semi-infinite stationary mode III cracks in bonded materials subjected to dynamic load. Two kinds of semi-infinite cracks are considered that either lies along or perpendicularly terminates the interface of two half-plane dissimilar materials perfectly bonded together. The stress fields near the crack tips are analyzed in which the propagations of the different stress waves are illustrated. The results show that the standard square root singularity of stress distribution is valid for the interface crack but untenable for the crack perpendicular to the interface.
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Ya-Pu Zhao and Jing Fang "Dynamic response of mode III interface crack in bonded materials", Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); https://doi.org/10.1117/12.158605
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KEYWORDS
Interfaces
Wavefronts
Adhesives
Wave propagation
Mechanics
Analog electronics
Particles
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