FET-SEED-based free-space optical backplanes

David V. Plant; Harvard Scott Hinton

doi:10.1117/12.174525

2 May 1994 FET-SEED-based free-space optical backplanes

David V. Plant, Harvard Scott Hinton

Author Affiliations +

Proceedings Volume 2153, Optoelectronic Interconnects II; (1994) https://doi.org/10.1117/12.174525
Event: OE/LASE '94, 1994, Los Angeles, CA, United States

Abstract

Free-space optical interconnects represent a solution to the needs of future connection- intensive digital systems such as ATM switching systems, and massively parallel processing computer systems. These systems require the large board-to-board connectivity provided by an optical backplane created with 2-D arrays of passive, free-space, parallel optical channels (POCs) to optically interconnect the systems electronic printed circuit boards (PCBs) and/or multi-chip modules (MCMs). Such a backplane will be capable of supporting terabit/second aggregate capacities with conductivity levels on the order of 10,000 input/output channels per PCB. Currently, we are developing the optical and optomechanical technology required for demonstrating these terabit capacity free-space optical backplanes. Results to be reported include the optical interconnection of two 4 X 4 FET-SEED transceiver smart pixel arrays, each being mounted on a separate PCB. Optical, electrical, mechanical, and thermal issues are discussed, and extensions of these results to future backplane projects are described.

Citation Download Citation

David V. Plant and Harvard Scott Hinton "FET-SEED-based free-space optical backplanes", Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); https://doi.org/10.1117/12.174525

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