Reliability growth of Ricor's micro IDCA products: status report

Nachman Pundak; Arnon Meromi; Yonadav Tzur; Z. Bar Haim; Sergey V. Riabzev; Gregory R. Leonard; J. Brian Toft; M. Long

doi:10.1117/12.218248

8 September 1995 Reliability growth of Ricor's micro IDCA products: status report

Nachman Pundak, Arnon Meromi, Yonadav Tzur, Z. Bar Haim, Sergey V. Riabzev, Gregory R. Leonard, J. Brian Toft, M. Long

Proceedings Volume 2552, Infrared Technology XXI; (1995) https://doi.org/10.1117/12.218248
Event: SPIE's 1995 International Symposium on Optical Science, Engineering, and Instrumentation, 1995, San Diego, CA, United States

Abstract

In 1986, the first model K506A micro IDCA (integral dewar cooler assembly) was introduced as a pioneer in the market of the infrared thermal imaging community. Since then, more than 2000 K506 coolers have been sold by Ricor and fielded in a variety of electro-optical instruments. A vast majority of these microcoolers have been integrated with Cincinnati Electronics detector/dewar assemblies. During the last year, two additional models of this family were introduced, model K508A -- having 500 mW at 80 K cooling power, and model K543 -- having 1000 mW at 80 K cooling power. These two models are in final qualification programs and are in a preliminary fielding process. A general view of these models is presented. As part of the qualification program, a life demonstration test is carried out under the supervision of EL-OP LTD. The mean time to first failure as based on the June 12, 1995 status of these ongoing tests is: MTTF > 3000 hours for the model K508A and MTTF > 3800 hours for model K543. Testing is continuing until all units have failed, as the coolers continue to run, the MTTF values will increase proportionately.

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Nachman Pundak, Arnon Meromi, Yonadav Tzur, Z. Bar Haim, Sergey V. Riabzev, Gregory R. Leonard, J. Brian Toft, and M. Long "Reliability growth of Ricor's micro IDCA products: status report", Proc. SPIE 2552, Infrared Technology XXI, (8 September 1995); https://doi.org/10.1117/12.218248

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KEYWORDS

Electro optical modeling

Reliability

Electronics

Thermal modeling

Data modeling

Failure analysis

Information technology

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