Paper
21 February 1996 Wire-bond inspection in IC assembly
Mandava Rajeswari, Mike G. Rodd
Author Affiliations +
Proceedings Volume 2665, Machine Vision Applications in Industrial Inspection IV; (1996) https://doi.org/10.1117/12.232240
Event: Electronic Imaging: Science and Technology, 1996, San Jose, CA, United States
Abstract
Wire-bonding in IC assembly process involves making a physical connection between the IC 'die' and the 'lead' by bonding wires between the two. Inspection of wire-bond quality is a' highly labor-intensive process and currently efforts are being made to automate it. This paper presents the results of a research conducted into developing a comprehensive automated wire- bond visual inspection system that is capable of performing final accept/reject inspection, providing on-line process feedback, and assisting in process validation. The proposed inspection system consists of the inspection of the bond on a bond pad, the bond on a lead and the inter-connecting wire between a bond pad and its corresponding lead. The algorithms are based on simple and easily extractable features that ensure achieving the desired accuracy and speed. A novel but simple illumination system is proposed to obtain the images of the inter- connecting wires. The proposed system is validated using several state-of-the-art IC samples. This work is sponsored by the Ministry of Science Technology and Environment, Malaysia and Intel Technology Pvt. Ltd., Malaysia.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mandava Rajeswari and Mike G. Rodd "Wire-bond inspection in IC assembly", Proc. SPIE 2665, Machine Vision Applications in Industrial Inspection IV, (21 February 1996); https://doi.org/10.1117/12.232240
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Inspection

Lead

Image segmentation

Imaging systems

Cameras

Optical inspection

Image analysis

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