Paper
31 March 1997 Processing applications with the 157-nm fluorine excimer laser
Peter R. Herman, Keith R. Beckley, Brian C. Jackson, Kou Kurosawa, David Moore, Takayuki Yamanishi, Jianhao Yang
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Abstract
Excimer-laser processing techniques can be extended to a broader and more diverse range of materials by moving to vacuum-ultraviolet laser source such as the molecular fluorine laser. The 157-nm output wavelength takes advantage of the high opacity in most materials and a short pulse duration to minimize thermal loading of target surfaces. The laser readily drives photochemical interactions and affords patterning of approximately 0.1-micrometers features. In this paper, we summarize the recent progress in our laboratory on applying these principles to the development of F2 laser applications. Examples include micromachining of high- bandgap optical materials, fabricating rib waveguides, growing debris-free silica films, driving photosensitivity responses in optical fibers, photochemical processing of III-V semiconductors, and writing fine-feature holographic structures.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter R. Herman, Keith R. Beckley, Brian C. Jackson, Kou Kurosawa, David Moore, Takayuki Yamanishi, and Jianhao Yang "Processing applications with the 157-nm fluorine excimer laser", Proc. SPIE 2992, Excimer Lasers, Optics, and Applications, (31 March 1997); https://doi.org/10.1117/12.270086
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Cited by 34 scholarly publications.
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KEYWORDS
Silica

Optical fibers

Etching

Laser ablation

Vacuum ultraviolet

Absorption

Excimer lasers

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