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7 July 1997 Thinking small: challenges for metrology at century's end
William H. Arnold
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Proceedings Volume 3050, Metrology, Inspection, and Process Control for Microlithography XI; (1997) https://doi.org/10.1117/12.275908
Event: Microlithography '97, 1997, Santa Clara, CA, United States
Abstract
This paper will consider the challenges facing linewidth metrology as devices shrink to the 100nm level and below, forcing all of us to 'thick small'. Significant improvements are needed in low voltage SEM resolution and measurement reproducibility. The applications of electrical probe metrology should be expanded through clever construction of test devices. Atomic force microscopy offers a novel way to measure feature size, as well as wall profiles and material thicknesses, but suffers from slow scan rates and data acquisition cycles. Advances in AFM need to address more rapid CD measurements and real-time imaging.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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William H. Arnold "Thinking small: challenges for metrology at century's end", Proc. SPIE 3050, Metrology, Inspection, and Process Control for Microlithography XI, (7 July 1997); https://doi.org/10.1117/12.275908
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Cited by 1 scholarly publication and 2 patents.
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KEYWORDS
Metrology
Scanning electron microscopy
Atomic force microscopy
Critical dimension metrology
Lithography
Electron microscopes
Inspection
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