Dry etching with consideration to thicker reticle size

Eiichi Hoshino; Hideaki Hasegawa; Kunio Shishido; Nobuyuki Yoshioka; Satoshi Aoyama; Atsushi Hayashi; Takaei Sasaki; Michael Hiroyuki Iso; Yasuo Tokoro

doi:10.1117/12.277254

28 July 1997 Dry etching with consideration to thicker reticle size

Eiichi Hoshino, Hideaki Hasegawa, Kunio Shishido, Nobuyuki Yoshioka, Satoshi Aoyama, Atsushi Hayashi, Takaei Sasaki, Michael Hiroyuki Iso, Yasuo Tokoro

Author Affiliations +

Proceedings Volume 3096, Photomask and X-Ray Mask Technology IV; (1997) https://doi.org/10.1117/12.277254
Event: Photomask Japan '97, 1997, Kawasaki City, Japan

Abstract

Studies of dry etching in consideration of thicker reticle size which was expected to be adopted for next reticle size were investigated with simulated plates. CD variation due to blanks thickness was evaluated in both of an electron beam and a laser beam reticle process with MoSiON embedded phase shift mask blanks by using a modifying magnetically enhanced RIE system (MEPS-6025) based on a method to predict surface voltage (Fig. 2). As blanks thickness increased up to 12.7 mm, CD variations were changed respectively (Fig. 5 and 6) along with surface bias voltage of blanks in discharge (Fig. 4). It was found that a bias voltage contribution between center and corner of the plate became closer corresponding to thickness of reticles size. Under this condition, 9 mm in thickness was found to be acceptable for dry etching process, because the effect of thickness may make discharge localize near by the substrate surface but any reason to deteriorate CDs could not appear in this feasibility study.

Citation Download Citation

Eiichi Hoshino, Hideaki Hasegawa, Kunio Shishido, Nobuyuki Yoshioka, Satoshi Aoyama, Atsushi Hayashi, Takaei Sasaki, Michael Hiroyuki Iso, and Yasuo Tokoro "Dry etching with consideration to thicker reticle size", Proc. SPIE 3096, Photomask and X-Ray Mask Technology IV, (28 July 1997); https://doi.org/10.1117/12.277254

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