Stress in thin films deposited by Reactive Low-Voltage Ion Plating is studied in air and at room temperature. A multilayer stack, composed of tantalum pentoxide and silicon dioxide layers, is considered and the interactions layer to layer turn out to have no effect as regards to the final bending. Evolution in stress after annealing shows the possibility to reduce the stress as well as the absorption for tantalum pentoxide thin films. Finally, ion implementation, such as helium and xenon, at high energy, prove to be also a way to vary and diminish the stress in thin films.
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