Robust packaging of photonic rf modules using ultrathin adaptive optical interconnect devices

Nabeel A. Riza; ShiFu Yuan

doi:10.1117/12.283941

23 October 1997 Robust packaging of photonic rf modules using ultrathin adaptive optical interconnect devices

Nabeel A. Riza, ShiFu Yuan

Proceedings Volume 3160, Optical Technology for Microwave Applications VIII; (1997) https://doi.org/10.1117/12.283941
Event: Optical Science, Engineering and Instrumentation '97, 1997, San Diego, CA, United States

Abstract

Ultra-thin, electrically programmable, low control power optical devices are proposed as adaptive optical alignment correction devices for future deployable photonic modules for RF signal processing applications. A substantial relative optical/RF gain (i.e., 7.92 dB RF gain) in a free- space PDL that requires a fiber remoted feed in the infrared 1300 nm optical spectrum has been successfully demonstrated.

Citation Download Citation

Nabeel A. Riza and ShiFu Yuan "Robust packaging of photonic rf modules using ultrathin adaptive optical interconnect devices", Proc. SPIE 3160, Optical Technology for Microwave Applications VIII, (23 October 1997); https://doi.org/10.1117/12.283941

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available