CIM for 300-mm semiconductor fab

Arthur Luk

doi:10.1117/12.284634

25 August 1997 CIM for 300-mm semiconductor fab

Arthur Luk

Proceedings Volume 3213, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III; (1997) https://doi.org/10.1117/12.284634
Event: Microelectronic Manufacturing, 1997, Austin, TX, United States

Abstract

Five years ago, factory automation (F/A) was not prevalent in the fab. Today facing the drastically changed market and the intense competition, management request the plant floor data be forward to their desktop computer. This increased demand rapidly pushed F/A to the computer integrated manufacturing (CIM). Through personalization, we successfully reduced a computer size, let them can be stored on our desktop. PC initiates a computer new era. With the advent of the network, the network computer (NC) creates fresh problems for us. When we plan to invest more than $3 billion to build new 300 mm fab, the next generation technology raises a challenging bar.

Citation Download Citation

Arthur Luk "CIM for 300-mm semiconductor fab", Proc. SPIE 3213, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III, (25 August 1997); https://doi.org/10.1117/12.284634

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