New applications of in-plane, shadow, and reflection moire methods

Fu-Pen Chiang; M. L. Du; I. M. Kao

doi:10.1117/12.323300

29 September 1998 New applications of in-plane, shadow, and reflection moire methods

Fu-Pen Chiang, M. L. Du, I. M. Kao

Proceedings Volume 3407, International Conference on Applied Optical Metrology; (1998) https://doi.org/10.1117/12.323300
Event: International Conference on Applied Optical Metrology, 1998, Balatonfured, Hungary

Abstract

This paper describes some recent applications of the classical moire methods. The first is the use of in-plane moire method to monitor crack tip strain during cyclic loading. A new model predicting the crack growth rate using crack tip strain as a parameter is proposed. The second is the development of a modified shadow moire method for mapping warpage of silicon wafers due to the presence of residual stress. Talbot effect is introduced to enhance the sensitivity of the shadow moire method. The third example is the use of a modified reflection moire method to monitor the quality of thin films deposited on substrates.

Citation Download Citation

Fu-Pen Chiang, M. L. Du, and I. M. Kao "New applications of in-plane, shadow, and reflection moire methods", Proc. SPIE 3407, International Conference on Applied Optical Metrology, (29 September 1998); https://doi.org/10.1117/12.323300

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