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A basic principle of thin-film interdiffusion phenomenon is described. An emphasis is placed on the type of microstructural modifications occurring in diffusion zones during the interdiffusion processes. These structural changes are discussed in relation to intermetallic compound formation, diffusion-induced high stresses, and diffusion-induced grain boundary migration.
S. Nakahara
"Phenomenological Description Of Thin Film Interdiffusion", Proc. SPIE 0346, Thin Film Technologies and Special Applications, (15 September 1982); https://doi.org/10.1117/12.933789
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S. Nakahara, "Phenomenological Description Of Thin Film Interdiffusion," Proc. SPIE 0346, Thin Film Technologies and Special Applications, (15 September 1982); https://doi.org/10.1117/12.933789