Optical interconnects for high-speed data links

Chang Myung Ryu; Bernhard Ulrich Koelle; Shane R. Johnson; Philip Dowd; Raenaurd Datrion Turpin; Parag Kelkar; YongHang Zhang

doi:10.1117/12.348313

30 April 1999 Optical interconnects for high-speed data links

Chang Myung Ryu, Bernhard Ulrich Koelle, Shane R. Johnson, Philip Dowd, Raenaurd Datrion Turpin, Parag Kelkar, YongHang Zhang

Author Affiliations +

Proceedings Volume 3631, Optoelectronic Integrated Circuits and Packaging III; (1999) https://doi.org/10.1117/12.348313
Event: Optoelectronics '99 - Integrated Optoelectronic Devices, 1999, San Jose, CA, United States

Abstract

We demonstrate the integration of vertical-cavity surface- emitting laser (VCSEL) arrays with Si-dummy chips for potential use in short-distance parallel optical interconnects. An 8 X 8 flip-chip bonded InGaAs VCSEL array was successfully modulated at data rates up to 0.8 Gbit/s/channel, corresponding to an aggregate data transmission capacity in excess of 50 Gbit/s. A 2 X 4 VCSEL array was indirectly flit-chip bonded to a Si substrate via a transparent glass carrier and package- limited data rates of 0.4 Gbit/s/channel were achieved. The large signal modulation bandwidth of these devices exceeded 2 Gbit/s. The electrical driving characteristics of the devices were found to be compatible with 3.3 V CMOS technology.

Citation Download Citation

Chang Myung Ryu, Bernhard Ulrich Koelle, Shane R. Johnson, Philip Dowd, Raenaurd Datrion Turpin, Parag Kelkar, and YongHang Zhang "Optical interconnects for high-speed data links", Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); https://doi.org/10.1117/12.348313

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