Submicron defect detection by SEMSpec: an e-beam wafer inspection system

Ning S. Chang

doi:10.1117/12.341147

8 March 1999 Submicron defect detection by SEMSpec: an e-beam wafer inspection system

Ning S. Chang

Proceedings Volume 3652, Machine Vision Applications in Industrial Inspection VII; (1999) https://doi.org/10.1117/12.341147
Event: Electronic Imaging '99, 1999, San Jose, CA, United States

Abstract

Traditionally, automated optical inspection techniques have been sufficient to find defects on wafers. However, defects smaller than 0.25 (mu) simply cannot be resolved by light optics due to optical limitation. KLA-Tencor SEMSpec is an advanced scanning electron-beam wafer inspection system that can detect defects down to 0.1 (mu) . The electron beam is scanned over the specimen surface, causing secondary electrons to be emitted from the surface where the beam impinges. These emitted secondary electrons are detected and the resulting image is formed so that conventional image processing techniques can also be applied. In the inspection sequence, fundamental parameters such as pixel size, defect detection sensitivity threshold, signal averaging, and cluster distance can be adjusted.

Citation Download Citation

Ning S. Chang "Submicron defect detection by SEMSpec: an e-beam wafer inspection system", Proc. SPIE 3652, Machine Vision Applications in Industrial Inspection VII, (8 March 1999); https://doi.org/10.1117/12.341147

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