Experimental method for quantifying acid diffusion in chemically amplified resists

Gregory M. Wallraff; William D. Hinsberg; Frances A. Houle; Mons D. Morrison; Carl E. Larson; Martha I. Sanchez; John A. Hoffnagle; Phillip J. Brock; Gregory Breyta

doi:10.1117/12.350196

11 June 1999 Experimental method for quantifying acid diffusion in chemically amplified resists

Gregory M. Wallraff, William D. Hinsberg, Frances A. Houle, Mons D. Morrison, Carl E. Larson, Martha I. Sanchez, John A. Hoffnagle, Phillip J. Brock, Gregory Breyta

Author Affiliations +

Proceedings Volume 3678, Advances in Resist Technology and Processing XVI; (1999) https://doi.org/10.1117/12.350196
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

The detailed structure of the 3D relief image formed upon processing a chemically amplified (CA) resist film is the result of a complex interplay of the projected optical image, the resist optical and photochemical properties, and the chemistry and physics of post-exposure thermal processing. During post-expose heating,the initial latent image of photogenerated acid is transformed into a developable chemical latent image of deprotected polymer whose form is governed by the kinetics of both a thermally- activated chemical deprotection reaction and the diffusion of photo-generated acid within the polymer film. WHile there have been recent advances in characterizing the chemistry and kinetics of deprotection in CA resist films, at present our fundamental quantitative understanding of photo-acid diffusion remains poor.

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Gregory M. Wallraff, William D. Hinsberg, Frances A. Houle, Mons D. Morrison, Carl E. Larson, Martha I. Sanchez, John A. Hoffnagle, Phillip J. Brock, and Gregory Breyta "Experimental method for quantifying acid diffusion in chemically amplified resists", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); https://doi.org/10.1117/12.350196

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