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MicroDisplay liquid crystal on silicon (LCOS) display devices are based on a combination of technologies combined with the extreme integration capability of conventionally fabricated CMOS substrates. Two recent SVGA (800 X 600) pixel resolution designs were demonstrated based on 10 micron and 12.5-micron pixel pitch architectures. The resulting microdisplays measure approximately 10 mm and 12 mm in diagonal respectively. Further, an XGA (1024 X 768) resolution display fabricated with a 12.5-micron pixel pitch with a 16-mm diagonal was also demonstrated. Both the larger SVGA and the XGA design were based on the same 12.5-micron pixel-pitch design, demonstrating a quickly scalable design architecture for rapid prototyping life-cycles. All three microdisplay designs described above function in grayscale and high-performance Field-Sequential-Color (FSC) operating modes. The fast liquid crystal operating modes and new scalable high- performance pixel addressing architectures presented in this paper enable substantially improved color, contrast, and brightness while still satisfying the optical, packaging, and power requirements of portable commercial and defense applications including ultra-portable helmet, eyeglass, and heat-mounted systems. The entire suite of The MicroDisplay Corporation's technologies was devised to create a line of mixed-signal application-specific integrated circuits (ASIC) in single-chip display systems. Mixed-signal circuits can integrate computing, memory, and communication circuitry on the same substrate as the display drivers and pixel array for a multifunctional complete system-on-a-chip. For helmet and head-mounted displays this can include capabilities such as the incorporation of customized symbology and information storage directly on the display substrate. System-on-a-chip benefits also include reduced head supported weight requirements through the elimination of off-chip drive electronics.
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