Thermo-acousto-photonics for noncontact temperature measurement in silicon wafer processing

Chii-Der Steve Suh; G. Andrew Rabroker; Ravinder Chona; Christian P. Burger

doi:10.1117/12.365738

13 October 1999 Thermo-acousto-photonics for noncontact temperature measurement in silicon wafer processing

Chii-Der Steve Suh, G. Andrew Rabroker, Ravinder Chona, Christian P. Burger

Proceedings Volume 3783, Optical Diagnostics for Fluids/Heat/Combustion and Photomechanics for Solids; (1999) https://doi.org/10.1117/12.365738
Event: SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, 1999, Denver, CO, United States

Abstract

A non-contact thermometry technique has been developed to characterize the thermal state of silicon wafers during rapid thermal processing. Information on thermal variations is obtained from the dispersion relations of the propagating waveguide mode excited in wafers using a non-contact, broadband optical system referred to as Thermal Acousto- Photonics for Non-Destructive Evaluation. Variations of thermo-mechanical properties in silicon wafers are correlated to temperature changes by performing simultaneous time-frequency analyses on Lamb waveforms acquired with a fiber-tip interferometer sensor. Experimental Lamb wave data collected for cases ranging from room temperature to 400 degrees C is presented. The results show that the temporal progressions of all spectral elements found in the fundamental antisymmetric mode are strong functions of temperature. This particular attribute is exploited to achieve a thermal resolution superior to the +/- 5 degrees C attainable through current pyrometric techniques. By analyzing the temperature-dependent group velocity of a specific frequency component over the temperature range considered and then comparing the results to an analytical model developed for silicon wafers undergoing annealing, excellent agreement was obtained. Presented results demonstrate the feasibility of applying laser-induced stress waves as a temperature diagnostic during rapid thermal processing.

Citation Download Citation

Chii-Der Steve Suh, G. Andrew Rabroker, Ravinder Chona, and Christian P. Burger "Thermo-acousto-photonics for noncontact temperature measurement in silicon wafer processing", Proc. SPIE 3783, Optical Diagnostics for Fluids/Heat/Combustion and Photomechanics for Solids, (13 October 1999); https://doi.org/10.1117/12.365738

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