Analytical study on a MEMS microcooling system for cooling flip chips

Andrew A. O. Tay; Francis E.H. Tay; Wenjie Li

doi:10.1117/12.368420

8 October 1999 Analytical study on a MEMS microcooling system for cooling flip chips

Andrew A. O. Tay, Francis E.H. Tay, Wenjie Li

Author Affiliations +

Proceedings Volume 3893, Design, Characterization, and Packaging for MEMS and Microelectronics; (1999) https://doi.org/10.1117/12.368420
Event: Asia Pacific Symposium on Microelectronics and MEMS, 1999, Gold Coast, Australia

Abstract

A MEMS micro-cooling system which comprises microchannel, micropump and pin-fin fan-sink technologies is proposed to meet the need of innovative and advanced IC cooling techniques for the microelectronics industry. An analytical study is conducted by employing a self-developed computer code. This study shows that the closed-loop MEMS micro- cooling system under the steady-state condition with water as the coolant has a capacity to remove heated flux as high as 100 W/cm² from the flip chip into the ambient. This can be done while maintaining the maximum temperature on the surface of the flip chip below 100 degrees C. Simulation and analysis of flow and heat transfer performance on this single-phase forced convection MEMS micro-cooling system are performed in both laminar and turbulent flows. The design parameters which include the coolant inlet pressure, the geometry of the silicon microchannel, the ambient temperature as well as the variety of the aluminum pin-fin fan-sink coolers show that these variables all have significant effect on the working performance of the system. The simulation results validated this new compact and highly efficient MEMS micro-cooling system.

Citation Download Citation

Andrew A. O. Tay, Francis E.H. Tay, and Wenjie Li "Analytical study on a MEMS microcooling system for cooling flip chips", Proc. SPIE 3893, Design, Characterization, and Packaging for MEMS and Microelectronics, (8 October 1999); https://doi.org/10.1117/12.368420

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