Submicron X-Ray Replication Technology For Early Application

C. R. Fencil; G. P. Hughes

doi:10.1117/12.935098

7 November 1983 Submicron X-Ray Replication Technology For Early Application

C. R. Fencil, G. P. Hughes

Proceedings Volume 0393, Electron-Beam, X-Ray and Ion-Beam Techniques for Submicron Lithographies II; (1983) https://doi.org/10.1117/12.935098
Event: 1983 Microlithography Conferences, 1983, Santa Clara, United States

Abstract

First-generation, full-wafer exposure, X-ray lithography equipment has been in continuous operation since 1979 in a pilot line application.(1,2,3) Second-generation, full-wafer exposure systems that incorporate the latest advancements in X-ray lithography are now being developed for early, submicron, VLSI patterning. This paper discusses recent advances in E-beam gun design and high-speed rotating anode development in terms of X-ray lithographic performances such as resolution and image contrast. In addition, the performance of a physical optics alignment technique that is compatible with submicron IC pattern overlay requirements is reported. The Perkin-Elmer X-100 full-wafer exposure system is a valuable development tool because of its flexibility. It is compatible with all X-ray masks and resists and can be used to expose either 75 mm or 100 mm diameter wafers.

Citation Download Citation

C. R. Fencil and G. P. Hughes "Submicron X-Ray Replication Technology For Early Application", Proc. SPIE 0393, Electron-Beam, X-Ray and Ion-Beam Techniques for Submicron Lithographies II, (7 November 1983); https://doi.org/10.1117/12.935098

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