Optimization of the e-beam sensitive bilayer CARL process for stencil mask making

Joerg Ochsenhirt; Joerg Butschke; Florian Letzkus; Bernd Hoefflinger; Mathias Irmscher; Christian Reuter; Reinhard Springer; Klaus Elian

doi:10.1117/12.377121

3 February 2000 Optimization of the e-beam sensitive bilayer CARL process for stencil mask making

Joerg Ochsenhirt, Joerg Butschke, Florian Letzkus, Bernd Hoefflinger, Mathias Irmscher, Christian Reuter, Reinhard Springer, Klaus Elian

Author Affiliations +

Proceedings Volume 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2000) https://doi.org/10.1117/12.377121
Event: 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, 1999, Munich, Germany

Abstract

Hardmask-less stencil mask making requires masks with a high aspect ratio. The bilayer CARL (chemical amplification of resist lines) process was evaluated and optimized with respect of generating irregular resist features below 180 nm in a film thickness of 750 nm. Especially the dry development was detailed investigated using statistical design and analysis of experiment. Processed CARL resist masks are compared with Top Surface Imaging results. Finally, results of a deep silicon etching process using the CARL resist masks are presented.

Citation Download Citation

Joerg Ochsenhirt, Joerg Butschke, Florian Letzkus, Bernd Hoefflinger, Mathias Irmscher, Christian Reuter, Reinhard Springer, and Klaus Elian "Optimization of the e-beam sensitive bilayer CARL process for stencil mask making", Proc. SPIE 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (3 February 2000); https://doi.org/10.1117/12.377121

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