Paper
10 April 2000 THERMODEL: a tool for thermal model generation and application for MEMS packages
Vladimir Szekely, Marta Rencz, Andras Poppe, Bernard Courtois
Author Affiliations +
Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382288
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
This paper present a tool and a method for the generation of reduce order thermal models, in order to assure modeling the effect of the package on the thermal behavior of the packaged device. The method is generic, and can be based either on the simulated or on the measured thermal transient response of the real packages. It is based on the generation of the time constant density spectrum of the thermal response function, from which we automatically generate a reduced order thermal model in the form of an RC ladder network model. Beyond presenting the generic methodology experimental results are also presented, based both on the simulation and measurement of MEMS elements and packages.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vladimir Szekely, Marta Rencz, Andras Poppe, and Bernard Courtois "THERMODEL: a tool for thermal model generation and application for MEMS packages", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); https://doi.org/10.1117/12.382288
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Cited by 4 scholarly publications.
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KEYWORDS
Thermal modeling

Microelectromechanical systems

Fused deposition modeling

Deconvolution

Instrument modeling

Convolution

Einsteinium

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