Paper
5 January 2001 McCarter superfinish grinding for silicon: an update
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Abstract
A grinding technique referred to as the McCarter Superfinish, for grinding large-size optical components is discussed and certain surface characterization information about flatness and the relative magnitude of the subsurface damage in silicon substrates is reported. The flatness measurements were obtained with a Wyko surface analyzer, and the substrate damage measurements were made by x-ray diffraction and acid etching. Results indicate excellent control of flatness and fine surface finish. X-ray measurements show that the diamond wheels with small particle sizes used in the final phases of the grinding operation renders surfaces with relatively small subsurface damage.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Frank M. Anthony, Ali M. Khounsary, Douglas R. McCarter, S. Felix Krasnicki, and Matt Tangedahl "McCarter superfinish grinding for silicon: an update", Proc. SPIE 4145, Advances in X-Ray Optics, (5 January 2001); https://doi.org/10.1117/12.411655
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Cited by 3 scholarly publications.
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KEYWORDS
Silicon

Crystals

X-rays

Particles

Wave plates

Copper

Surface finishing

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